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DA1175.008 13 July, 2006
MAS1175
IC FOR 10.00 - 20.00 MHz VCTCXO
Low Power Wide Supply Voltage Range True Sine Wave Output Very High Level of Integration * Electrically Trimmable * Very Low Phase Noise * Low Cost * * * *
DESCRIPTION
The MAS1175 is an integrated circuit well suited to build VCTCXO for mobile communication. Only two external components are needed. Temperature calibration is achieved with three calibration points only. The trimming is done through a serial bus and the calibration information is stored in an internal PROM. To build a VCTCXO only two additional components, a varactor and a crystal are needed. The compensation method is fully analog. IC compensation work is continuous without generating any steps or other interferences.
FEATURES
* * * * * Very small size Minimum current draw Wide operating temperature range Phase noise <-130 dBc/Hz at 1 kHz offset VCTCXO for mobile phones
APPLICATIONS
* VCTCXO for other telecommunications systems
BLOCK DIAGRAM
DA CLK PV VC
CUB INF SENS LIN
4 4
f(T)
MAS1175
TE1
4
f(T)
8
T
Vref
TMux
TE2
CDAC1
8
VDD
CDAC2
2
OUT X2 X1
VSS
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DA1175.008 13 July, 2006
PIN DESCRIPTION
Pin Description Power Supply Voltage Programming Input Serial Bus Clock Input Serial Bus Data Input Temperature Output Test Multiplexer Output Voltage Control Input Crystal Oscillator Output Crystal/Varactor Oscillator Input Power Supply Ground Buffer Output Symbol VDD PV CLK DA TE1 TE2 VC X1 X2 VSS OUT x-coordinate 263 503 745 1001 1246 1454 190 398 1355 1828 2031 y-coordinate 1330 1326 1321 1321 1325 1325 231 231 231 242 231
Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or left floating. Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Input Voltage Power Dissipation Storage Temperature Note: Not valid for programming pin PV Symbol VDD - VSS VIN PMAX TST Min -0.3 VSS -0.3 -55 Max 6.0 VDD + 0.3 20 150 Unit V V mW o C Note 1)
RECOMMENDED OPERATION CONDITIONS
Parameter Supply Voltage Supply Current Operable Temperature Storage Temperature Crystal Pulling Sensitivity Load Capacitance Symbol VDD ICC TC TS S CL Conditions Vcc = 2.8 Volt Relative humidity = 15%...70% -30 -5 30 10 Min 2.7 Typ 2.8 Max 5.5 1.8 +85 +40 Unit V mA o C o C ppm/pF pF
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DA1175.008 13 July, 2006
ELECTRICAL CHARACTERISTICS
Parameter Frequency Range Voltage Control Range Voltage Control Sensitivity Output Voltage (10k // 10 pF) Compensation Range 2.5 ppm Compensation Range 2.0 ppm Compensation Range Linear Part Compensation Inflection Point Compensation Range Cubic Part Compensation CDAC1 (8 Bit) Compensation CDAC2 (2 Bit) Startup Time Symbol fo VC VCSENS Vout TC TC a1 INF a3 CX1 CX2 TSTART C10 C20 2 -30 -25 -0.7 25 95 C10 + 18 C20 + 4 Min 10.00 0 10 1.0 85 75 0.0 31 Typ Max 20.00 Vdd ppm/V Vpp
o o
Unit MHz
Note
C C C 2) 3)
ppm/K
o
ppm2/K3 pF pF ms
Note 2: typ C10 = 14pF Note 3: typ C20 = 5pF (varactor capacitance has to be added)
IC OUTLINES
VDD
PV
CLK
DA
TE1
TE2
MAS1175
1556 m
VC
X1
X2
VSS
OUT
Die map reference
2234 m
Note 1: MAS1175A pads are round with 95 m diameter at opening. Note 2: Pins PV and TE1 shall not be connected and pins CLK and DA can either be connected to VSS or left open in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip.
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DA1175.008 13 July, 2006
DEVICE OUTLINE CONFIGURATION
MSOP10 (SnPb)
MSOP10 (Green) OUT VSS X2 X1 VC Top View TE2 DA CLK PV VDD OUT VSS X2 X1 VC
1175 AYWW
A = product version Y = year WW= week
TE2 DA CLK PV VDD
A = product version Y = year WW= week G=Green/RoHs Compliant
1175 AG YWW
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DA1175.008 13 July, 2006
PACKAGE (MSOP-10) OUTLINE
e S See Detail A c B E1 E1 B E E 5-15 Degrees L1 Detail A A2 A A1 D L G M A A 0 - 8 Degrees Gauge Plane L2 Seating Plane N F Land Pattern Recommendation b1 (b) Section B - B c1
Symbol A A1 A2 b b1 c c1 D E E1 e F G L (Terminal length for soldering) L1 L2 M N S
Min -0.00 0.75 0.15 0.15 0.08 0.08
Nom --0.85 ----
Max 1.10 0.15 0.95 0.30 0.25 0.23 0.18
Unit mm mm mm mm mm mm mm mm mm mm mm mm mm mm
0.40
3.00 BSC 4.90 BSC 3.00 BSC 0.50 BSC 4.8 0.50 0.60
0.80
0.95 REF 0.25 BSC 0.41 1.02 0.50
mm mm mm Mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs. Reference Standard : JEDEC MO-187 BA. 5 (9)
DA1175.008 13 July, 2006
SOLDERING INFORMATION
N For Sn/Pb MSOP-10 Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish According to RSH test IEC 68-2-58/20 2*220C 240C 3 Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 m, material Sn 85% Pb 15%
N For Pb Free, RoHS Compliant MSOP-10 Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Lead Finish According to RSH test IEC 68-2-58/20 260C 3 Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org Solder plate 7.62 - 25.4 m, material Matte Tin
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DA1175.008 13 July, 2006
EMBOSSED TAPE SPECIFICATIONS
P1 P2
E W F
PO
DO
T
BO
AO
User Direction of Feed
A
D1
Section A-A
KO
Pin 1 Designator
Dimension Ao Bo Do D1 E F Ko Po P1 P2 T W
Min/Max 5.00 0.10 3.20 0.10 1.50 +0.1/-0.0 1.50 min 1.75 5.50 0.05 1.45 0.10 4.0 8.0 0.10 2.0 0.05 0.3 0.05 12.00 +0.30/-0.10
Unit mm mm mm mm mm mm mm mm mm mm mm mm
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DA1175.008 13 July, 2006
REEL SPECIFICATIONS
W2
A
D B
Tape Slot for Tape Start
C
N
W1
5000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative
Carrier Tape Cover Tape End
Start
Trailer
Dimension A B C D N W 1 (measured at hub) W 2 (measured at hub) Trailer Leader Min
Components
Max 330 1.5 12.80 20.2 50 12.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 1500 13.50
Leader
Unit mm mm mm mm mm mm mm mm mm
14.4 18.4
Weight
g
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DA1175.008 13 July, 2006
ORDERING INFORMATION
Product Code MAS1175ATB1 MAS1175ASM1-T MAS1175A1SN06 Product IC FOR VCTCXO IC FOR VCTCXO IC FOR VCTCXO Package Tested wafers, 480 m MSOP10 Comments Die Size 2.233x1.556 mm Tape & Reel Tape & Reel
Green MSOP-10, Pb Free, RoHS Compliant Please contact Micro Analog Systems Oy for other wafer thickness options.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com
NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.
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